Patent Assignment
Reel/Frame 031849/0588
Assignment of Assignor's Interest
Recorded: 2013-12-26
Pages: 5
Assignors
TSENG, CHI-XIANG
Executed: 2013-12-19
LEE, HSIAO-WEN
Executed: 2013-12-19
WU, MIN-SHENG
Executed: 2013-12-20
LIN, TIEN-MIN
Executed: 2013-12-19
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Method and Apparatus for Packaging Phosphor-Coated Leds
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Mar 26, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 038107/0962 →
Change of Name
Mar 26, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 038263/0076 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →