Multi-vertical LED packaging structure

1. A light-emitting diode (LED) packaging structure, comprising:

a submount, said submount including a substrate;

a plurality of conductive pads located on the substrate;

a plurality of LEDs bonded to the submount substrate through the plurality of conductive pads, wherein the plurality of LEDs includes p-type vertical LEDs and n-type vertical LEDs that are arranged in an alternating manner in a p-n-p-n-p-n configuration; and

a transparent material disposed between the plurality of LEDs and over a portion of a top surface of each of the plurality of LEDs, wherein a plurality of openings are defined by portions of the transparent material disposed over the portion of the top surface of each of the plurality of LEDs;

wherein:

the p-type and n-type vertical LEDs each include a respective p-type doped semiconductor layer and an n-type doped semiconductor layer;

for the p-type vertical LED, the p-type doped semiconductor layer is located closer to the submount substrate than the n-type doped semiconductor layer; and

for the n-type vertical LED, the n-type doped semiconductor layer is located closer to the submount substrate than the p-type doped semiconductor layer.

2. The LED packaging structure of claim 1 , further comprising: a plurality of transparent cladding layer (TCL) components disposed over the plurality of LEDs and partially within the openings, respectively, wherein each TCL component is configured to electrically couple together one of the p-type vertical LEDs with an adjacent one of the n-type vertical LEDs.

3. The LED packaging structure of claim 1 , wherein the LED packaging structure is free of bond wires.

4. The LED packaging structure of claim 1 , wherein a subset of the bond pads are each configured to electrically couple together a p-type vertical LED and an adjacent n-type vertical LED.

5. The LED packaging structure of claim 1 , further comprising:

a phosphor film disposed over the plurality of LEDs; and

a protective layer disposed over the phosphor film, the protective layer having a roughened surface.

6. The LED packaging structure of claim 1 , further comprising: one or more lenses disposed over the plurality of LEDs, wherein the one or more lenses and the submount substrate are disposed on opposite sides of the LEDs.

7. The LED packaging structure of claim 1 , wherein:

the plurality of conductive pads include a first subset of conductive pads located on a first surface of the submount substrate and a second subset of conductive pads located on a second surface of the submount substrate opposite the first surface; and

the substrate contains a plurality of through-substrate-vias that electrically interconnect the second subset of the conductive pads with some of the first subset of the conductive pads.

8. A photonic lighting apparatus, comprising:

a submount including a substrate and a plurality of bond pads disposed on a first side of the substrate;

a plurality of p-type light-emitting diodes (LEDs) bonded to the substrate through a first subset of the bond pads;

a plurality of n-type LEDs bonded to the substrate through a second subset of the bond pads, wherein some of the bond pads belong to both the first subset and the second subset of the bond pads, and wherein the p-type LEDs and the n-type LEDs are arranged as alternating pairs according to a p-n-p-n-p-n configuration;

a transparent material disposed between the plurality of LEDs and over a portion of a top surface of each of the plurality of LEDs, wherein a plurality of openings are defined by portions of the transparent material disposed over the portion of the top surface of each of the plurality of LEDs;

a plurality of transparent conductive components each disposed over and electrically interconnecting one of the pairs of the p-type and n-type LEDs, wherein the transparent conductive components each include a respective portion that is disposed within a respective one of the openings; and

one or more lenses disposed over the n-type LEDs and the p-type LEDs, wherein said n-type LEDs and said p-type LEDs are vertical LEDs.

9. The photonic lighting apparatus of claim 8 , wherein the p-type and n-type LEDs of the photonic lighting apparatus are electrically interconnected without bond wires.

10. The photonic lighting apparatus of claim 8 , wherein the plurality of p-type and n-type LEDs are electrically interconnected together using the bond pads and the transparent and conductive components.

11. The photonic lighting apparatus of claim 8 , wherein:

the submount includes a plurality of through-substrate-vias (TSVs) that are electrically coupled to some of the bond pads;

the submount includes further bond pads that are located on a second side of the substrate opposite from the first side to which the LEDs are bonded; and

the further bond pads are electrically coupled to the TSVs.

12. A packaging structure, comprising:

a submount;

a plurality of metal pads located on the submount;

a plurality of photonic devices bonded to the submount through the plurality of metal pads; and

a transparent material disposed between the plurality of photonic devices and over a portion of a top surface of each of the plurality of photonic devices, wherein a plurality of openings are defined by portions of the transparent material disposed over the portion of the top surface of each of the plurality of photonic devices;

wherein:

the photonic devices include a first subset of photonic devices and a second subset of photonic devices;

the first subset of photonic devices each include a light-emitting layer, a p-type layer disposed above the light-emitting layer, and an n-type layer disposed below the light-emitting layer;

the second subset of photonic devices each include a light-emitting layer, an n-type layer disposed above the light-emitting layer, and a p-type layer disposed below the light-emitting layer; and

the first subset of photonic devices and the second subset of photonic devices interleave with one another in a p-n-p-n-p-n configuration, and wherein each of the first subset of photonic devices and the second subset of photonic devices include a vertical light-emitting diode (LED).

13. The packaging structure of claim 12 , wherein the packaging structure is free of bond wires.

14. The packaging structure of claim 12 , wherein the submount comprises a substrate and additional bond pads disposed on the substrate, and said metal bond pads are disposed on said additional bond pads, and wherein some of the additional bond pads have a respective photonic device from the first subset.

15. The packaging structure of claim 12 , wherein the first and second subsets of photonic devices interleave in a manner such that:

the n-type layer of a first one of the photonic devices is electrically coupled to the p-type layer of a second one of the photonic devices;

the p-type layer of the first one of the photonic devices is electrically coupled to the n-type layer of a third one of the photonic devices; and

the first one of the photonic devices is disposed between the second one and the third one of the photonic devices.

16. The packaging structure of claim 12 , further comprising: one or more lenses disposed over the plurality of photonic devices, wherein the one or more lenses and the submount are disposed on opposite sides of the photonic devices.

17. The packaging structure of claim 12 , wherein the submount includes one or more through-vias that are each electrically coupled to a respective one of the metal pads.

18. The packaging structure of claim 12 , further comprising: a plurality of transparent cladding layer (TCL) components disposed over the plurality of photonic devices and partially within the openings, respectively, wherein each TCL component is configured to electrical couple together the p-type layer of one of the photonic devices to the n-type layer of another one of the photonic devices.