Patent Assignment
Reel/Frame 029694/0054
Assignment of Assignor's Interest
Recorded: 2013-01-25
Pages: 5
Assignors
WENG, JUI-PING
Executed: 2013-01-21
LEE, HSIAO-WEN
Executed: 2013-01-22
CHANG, CHUN-CHIH
Executed: 2013-01-22
WU, MIN-SHENG
Executed: 2013-01-22
LEE, HSIN-HSIEN
Executed: 2013-01-21
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH RD., HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Multi-Vertical LED Packaging Structure
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0571 →
Change of Name
Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037809/0929 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →