IP Library Granted Patent US 7,273,798
Granted Patent B2
US 7,273,798 · App. 11/194,237 · Granted Sep 25, 2007

Gallium nitride device substrate containing a lattice parameter altering element

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Quick Facts
Patent No.
US 7,273,798
App. No.
11/194,237
Granted
Sep 25, 2007
Kind
B2
Abstract

A gallium nitride device substrate comprises a layer of gallium nitride containing an additional lattice parameter altering element located over a substitute substrate.

Claims (18)

1. A method of forming a gallium nitride device substrate, comprising:

providing a first sacrificial substrate;

forming a layer of gallium nitride over the first sacrificial substrate;

forming a first layer of gallium nitride containing an additional lattice parameter altering element over the layer of gallium nitride, the additional lattice parameter altering element causing the first layer of gallium nitride containing the lattice parameter altering element to grow strained so that a lattice parameter of the first layer of gallium nitride containing the lattice parameter altering element conforms to a lattice parameter of the layer of gallium nitride;

attaching a substitute substrate to the first layer of gallium nitride containing an additional lattice parameter altering element; and

removing the sacrificial substrate and the layer of gallium nitride, causing the lattice parameter of the first layer of gallium nitride containing the lattice parameter altering element to relax, and revealing the first layer of gallium nitride containing the lattice parameter altering element.

2. The method of claim 1 , in which the additional lattice parameter altering element is chosen from aluminum and indium.

3. The method of claim 2 , in which the first layer of gallium nitride containing an additional lattice parameter altering element has a composition of In x Ga 1-x N, where 0≦x≦1.

4. The method of claim 3 , in which the first layer of gallium nitride containing an additional lattice parameter altering element has a composition of In 0.1 Ga 0.9 N.

5. The method of claim 2 , in which the first layer of gallium nitride containing an additional lattice parameter altering element has a composition of Al x Ga 1-x N, where 0≦x≦1.

6. The method of claim 5 , in which the first layer of gallium nitride containing an additional lattice parameter altering element has a composition of Al 0.1 Ga 0.9 N.

7. The method of claim 2 , further comprising:

forming a second layer of gallium nitride containing the additional lattice parameter altering element over the first layer of gallium nitride containing the additional lattice parameter altering element;

attaching an additional substitute substrate to the second layer of gallium nitride containing the additional lattice parameter altering element; and

removing the substitute substrate and the first layer of gallium nitride containing the additional lattice parameter altering element.

8. The method of claim 7 , in which the additional lattice parameter altering element is indium.

9. The method of claim 8 , in which the second and subsequent layers of gallium nitride containing an additional lattice parameter altering element have a composition of In x Ga 1-x N, where 0≦x23 1.

10. The method of claim 9 , in which the second layer of gallium nitride containing an additional lattice parameter altering element has a composition of In 0.2 Ga 0.8 N.

Assignments (8)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 017206 FRAME: 0666. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →
MERGER Recorded Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0571 →
CHANGE OF NAME Recorded Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037809/0929 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 12, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
To: TSMC SOLID STATE LIGHTING LTD
Reel/Frame 028032/0545 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2011
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 026875/0665 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
Reel/Frame 017675/0518 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017206/0666 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 8, 2006
From: LESTER, STEVEN D.; ROBBINS, VIRGINIA M.; CORZINE, SCOTT W.
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 017142/0086 →