Patent Assignment
Reel/Frame 029403/0652
Assignment of Assignor's Interest
Recorded: 2012-12-04
Pages: 5
Assignors
LI, ZHEN-YU
Executed: 2012-09-24
LIN, CHUNG-PAO
Executed: 2012-09-24
HSIA, HSING-KUO
Executed: 2012-09-24
KUO, HAO-CHUNG
Executed: 2012-09-24
SHU, CINDY HUICHUN
Executed: 2012-10-03
HUANG, HSIN-CHIEH
Executed: 2012-10-02
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Pre-Cutting a Back Side of a Silicon Substrate for Growing Better III-V Group Compound Layer on a Front Side of the Substrate
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0571 →
Change of Name
Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037809/0929 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →