IP Library Granted Patent US 9,099,593
Granted Patent B2
US 9,099,593 · App. 13/616,299 · Granted Aug 4, 2015

III-V group compound devices with improved efficiency and droop rate

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Quick Facts
Patent No.
US 9,099,593
App. No.
13/616,299
Granted
Aug 4, 2015
Kind
B2
Abstract

The present disclosure involves an illumination apparatus. The illumination apparatus includes an n-doped semiconductor compound layer, a p-doped semiconductor compound layer spaced apart from the n-doped semiconductor compound layer, and a multiple-quantum-well (MQW) disposed between the first semiconductor compound layer and the second semiconductor compound layer. The MQW includes a plurality of alternating first and second layers. The first layers of the MQW have substantially uniform thicknesses. The second layers have graded thicknesses with respect to distances from the p-doped semiconductor compound layer. A subset of the second layers located most adjacent to the p-doped semiconductor compound layer is doped with a p-type dopant. The doped second layers have graded doping concentration levels that vary with respect to distances from the p-doped semiconductor layer.

Claims (59)

1. A photonic device, comprising:

an n-type III-V group layer disposed over a substrate;

a p-type III-V group layer disposed over the n-type layer;

a quantum well disposed between the n-type III-V group layer and the p-type III-V group layer;

wherein:

the quantum well includes a plurality of active layers interleaved with a plurality of barrier layers such that each barrier layer is separated from adjacent barrier layers by a respective one of the active layers;

the active layers have substantially uniform thicknesses;

a subset of the barrier layers are doped with a p-type dopant;

the dopant concentration for the barrier layers in the subset are inversely correlated with distances between the barrier layer and the p-type III-V group layer; and

a thickness of each barrier layer is a function of its location with respect to the p-type III-V group layer such that each barrier layer is thicker than an immediately adjacent barrier layer that is located closer to the p-type III-V group layer.

2. The photonic device of claim 1 , wherein the adjacent barrier layers have a variation in thickness, and wherein the variation in thickness between adjacent barrier layers is in a range from about 5% to about 15%.

3. The photonic device of claim 1 , wherein:

the n-type III-V group layer includes n-doped gallium nitride (n-GaN);

the p-type III-V group layer includes p-doped gallium nitride (p-GaN);

the active layers contain indium gallium nitride (InGaN); and

the barriers layers contain gallium nitride (GaN).

4. The photonic device of claim 1 , wherein the photonic device includes one of: a light-emitting diode (LED) and a laser diode (LD).

5. The photonic device of claim 4 , further comprising a lamp in which the LED or the LD are located.

6. The photonic device of claim 1 , wherein the photonic device includes a lighting module having a plurality of dies, and wherein the n-type and p-type III-V group layers and the quantum well are implemented in each of the dies.

7. The photonic device of claim 1 , wherein the subset of the barrier layers include at least three barrier layers that are located the closest to the p-type III-V group layer.

8. The photonic device of claim 1 , wherein each of the barrier layers in the subset has a respective doping concentration level that is a function of its location with respect to the p-type III-V group layer.

9. The photonic device of claim 1 , further comprising: a pre-strained layer disposed between the n-type III-V group layer and the quantum well, wherein the pre-strained layer is doped with an n-type dopant and contains a super-lattice structure.

10. The photonic device of claim 1 , further comprising an electron blocking layer that is disposed between the p-type III-V group layer and the quantum well.

11. The photonic device of claim 8 , wherein the function is such that the doping concentration levels of the barrier layers in the subset increase as distances between the barrier layers and the p-type III-V group layer shrink.

12. A photonic device, comprising:

an n-type III-V group layer disposed over a substrate;

a p-type III-V group layer disposed over the n-type layer;

a quantum well disposed between the n-type III-V group layer and the p-type III-V group layer;

wherein:

the quantum well includes a plurality of active layers interleaved with a plurality of barrier layers such that the barrier layers are not in direct contact with other barrier layers;

at least some of the barrier layers in the quantum well are doped with a p-type dopant;

the doping concentration for the barrier layers that are doped varies from one barrier layer to another barrier layer and increases as distances between the barrier layer and the p-type III-V group layer become smaller;

all of the active layers have substantially uniform thicknesses; and

the barrier layers become thinner as they approach the p-type III-V group layer such that the barrier layer located the closest to the p-type III-V group layer is a thinnest barrier layer, and the barrier layer located the farthest from the p-type III-V group layer is a thickest barrier layer.

13. The photonic device of claim 12 , wherein the barrier layers that are doped include at least three barrier layers that have shortest distances from the p-type III-V group layer.

14. The photonic device of claim 12 , wherein:

the n-type III-V group layer includes n-doped gallium nitride (n-GaN);

the p-type III-V group layer includes p-doped gallium nitride (p-GaN);

the active layers contain indium gallium nitride (InGaN); and

the barriers layers contain gallium nitride (GaN).

15. The photonic device of claim 12 , the photonic device includes one of: a light-emitting diode (LED) and a laser diode (LD).

16. The photonic device of claim 15 , further comprising a lamp in which the LED or the LD are located.

17. The photonic device of claim 12 , wherein the photonic device includes a lighting instrument whose light source includes one or more light-emitting dies, and wherein the n-type and p-type III-V group layers and the quantum well are implemented in each of the one or more light-emitting dies.

18. An illumination apparatus, comprising:

an n-doped semiconductor compound layer;

a p-doped semiconductor compound layer spaced apart from the n-doped semiconductor compound layer; and

a multiple-quantum-well (MQW) disposed between the first semiconductor compound layer and the second semiconductor compound layer, the MQW including a plurality of alternating first and second layers;

wherein:

the first layers of the MQW have substantially uniform thicknesses;

the second layers have graded thicknesses with respect to distances from the p-doped semiconductor compound layer such that the second layers become thinner as they approach the p-doped semiconductor compound layer; and

a subset of the second layers located most adjacent to the p-doped semiconductor compound layer is doped with a p-type dopant, the subset of the second layers having graded doping concentration levels that vary with respect to distances from the p-doped semiconductor layer such that the doping concentration levels for the subset of doped second layers become greater as they approach the p-doped semiconductor compound layer.

19. The illumination apparatus of claim 18 , wherein:

the n-doped semiconductor compound layer includes n-doped gallium nitride (n-GaN);

the p-doped semiconductor compound layer includes p-doped gallium nitride (p-GaN);

the first layer of the MQW includes indium gallium nitride (InGaN); and

the second layer of the MQW includes gallium nitride (GaN).

20. The illumination apparatus of claim 18 , wherein:

the apparatus is a lighting module having a light-emitting diode (LED) or a laser diode (LD) as its light source; and

the n-doped semiconductor compound layer, the p-doped semiconductor compound layer, and the MQW are disposed within the LED or the LD.

Assignments (4)
CHANGE OF NAME Recorded Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →
MERGER Recorded Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0571 →
CHANGE OF NAME Recorded Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037809/0929 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 13, 2012
From: LI, ZHEN-YU; LIN, HON-WAY; LIN, CHUNG-PAO; HSIA, HSING-KUO; KUO, HAO-CHUNG
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 029460/0136 →