IP Library Assignment 025012/0692
Patent Assignment
Reel/Frame 025012/0692

Assignment of Assignor's Interest

Recorded: 2010-09-20 Pages: 8
Assignors
O'ROURKE, SHAWN
Executed: 2009-05-01
LOY, DOUGLAS
Executed: 2009-05-01
JIANG, HANQING
Executed: 2009-06-17
Assignee
Covered Property (1)
Assemblies and Methods for Reducing Warp and Bow of a Flexible Substrate During Semiconductor Processing
Patent: 8,685,201 →
Application: 12/921,896 →
Publication: US 2011/0064953