Patent Assignment
Reel/Frame 025016/0197
Assignment of Assignor's Interest
Recorded: 2010-09-20
Pages: 2
Assignor
WINTER, THOMAS E.
Executed: 2010-09-15
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU,, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Processing a Wafer with a Post Application Bake (Pab) Procedure