Patent Assignment
Reel/Frame 025022/0175
Assignment of Assignor's Interest
Recorded: 2010-09-21
Pages: 3
Assignor
KAN, SHYI-HERNG
Executed: 2010-08-30
Assignee
HELIOS APPLIED SYSTEMS PTE LTD
55 KAKI BUKIT VIEW, KAKI BUKIT TECH PARK II, SINGAPORE, 415976, SINGAPORE
Covered Property
(1)
3D Mold For Manufacturing Of Sub-Micron 3D Structures Using 2-D Photon Lithography And Nanoimprinting And Process Thereof