Patent Assignment
Reel/Frame 025027/0266
Assignment of Assignor's Interest
Recorded: 2010-09-20
Pages: 2
Assignors
KOTANI, HAYATO
Executed: 2010-09-06
URASAKI, NAOYUKI
Executed: 2010-09-06
MIZUTANI, MAKOTO
Executed: 2010-09-06
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI SHINJUKU 2-CHOME, SHINJUKU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Thermosetting Resin Composition, Epoxy Resin Molding Material, and Polyvalent Carboxylic Acid Condensate
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →