Patent Assignment
Reel/Frame 025068/0254
Assignment of Assignor's Interest
Recorded: 2010-09-30
Pages: 2
Assignors
YI, DONG-HUN
Executed: 2010-09-28
JEON, JONG-KEUN
Executed: 2010-09-28
LEE, YONG-JIN
Executed: 2010-09-28
KIM, KEE-SEOK
Executed: 2010-09-28
Assignee
SAMSUNG ELECTRONICS CO., LTD
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Image Sensor Module Having a Wafer Level Chip Size Package and Method of Manufacting the Same and Imaging Device Including the Image Sensor Module and Method of Manufacturing the Image Device