IP Library Assignment 025068/0564
Patent Assignment
Reel/Frame 025068/0564

Assignment of Assignor's Interest

Recorded: 2010-09-30 Pages: 3
Assignor
SCHWANDNER, JUERGEN
Executed: 2010-09-22
Assignee
SILTRONIC AG
HANNS-SEIDEL-PLATZ 4, MUNICH, 81737, GERMANY
Covered Property (1)
Method for Grinding a Semiconductor Wafer
Patent: 8,501,028 →
Application: 12/894,468 →
Publication: US 2011/0081836
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Jun 30, 2021
From: SILTRONIC AG
To: SILTRONIC AG
Reel/Frame 056719/0881 →
Corrective Assignment to Correct the Date of the Change of Address from 03/12/2020 to 12/03/2020 Previously Recorded at Reel: 056719 Frame: 0881. Assignor(S) Hereby Confirms the Assignment. Jul 1, 2021
From: SILTRONIC AG
To: SILTRONIC AG
Reel/Frame 057561/0451 →