Patent Assignment
Reel/Frame 025082/0931
Assignment of Assignor's Interest
Recorded: 2010-10-01
Pages: 3
Assignors
SATO, ATSUSHI
Executed: 2010-08-27
ABE, HISAYUKI
Executed: 2010-08-16
OTA, TAKASHI
Executed: 2010-08-16
YANAGIDA, MIYUKI
Executed: 2010-08-27
KAMEDA, MASUMI
Executed: 2010-08-30
Assignee
TDK CORPORATION
1-13-1, NIHONBASHI, CHUO-KU, TOKYO 103-8272, JAPAN
Covered Property
(1)
Plating Film, Printed Wiring Board, and Module Substrate