Patent Assignment
Reel/Frame 025082/0954
Assignment of Assignor's Interest
Recorded: 2010-10-01
Pages: 3
Assignors
SONG, IN-SANG
Executed: 2010-09-02
LIM, SEOK-KEUN
Executed: 2010-09-09
JUNG, IN-WOOK
Executed: 2010-09-15
YU, BONG-KEN
Executed: 2010-09-15
PARK, SANG-WOOK
Executed: 2010-09-02
HONG, JI-SEOK
Executed: 2010-09-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package, Semiconductor Package Structure Including the Semiconductor Package, and Mobile Phone Including the Semiconductor Package Structure