Patent Assignment
Reel/Frame 025086/0065
Assignment of Assignor's Interest
Recorded: 2010-10-04
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2010-09-29
CHANG, HUNG-PIN
Executed: 2010-09-29
LIN, YUNG-CHI
Executed: 2010-09-29
YU, CHIA-LIN
Executed: 2010-09-28
HUNG, JUI-PIN
Executed: 2010-09-28
HWANG, CHIEN LING
Executed: 2010-09-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Novel Semiconductor Package with Through Silicon Vias
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 13, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027852/0591 →
Merger
Dec 2, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037196/0816 →
Change of Name
Dec 2, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037211/0130 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →