IP Library › Assignment 025086/0945
Patent Assignment
Reel/Frame 025086/0945

Assignment of Assignor's Interest

Recorded: 2010-10-04 Pages: 5
Assignors
BERGER, INGO
Executed: 2009-06-04
MUENZER, JAN
Executed: 2009-06-04
REINKENSMEIER, INGO
Executed: 2009-06-04
SETTEGAST, SILKE
Executed: 2009-06-04
Assignee
SIEMENS AKTIENGESELLSCHAFT
WITTELSBACHERPLATZ 2, MUENCHEN, 80333, GERMANY
Covered Property (1)
Method for Soldering with a Multistep Temperature Profile
Patent: 8,123,110 →
Application: 12/897,249 →
Publication: US 2011/0017809
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 8, 2021
From: SIEMENS AKTIENGESELLSCHAFT
To: SIEMENS ENERGY GLOBAL GMBH & CO. KG
Reel/Frame 055875/0520 →