Patent Assignment
Reel/Frame 025092/0206
Assignment of Assignor's Interest
Recorded: 2010-10-05
Pages: 3
Assignors
MURATA, HITOSHI
Executed: 2010-08-02
KOSUGI, TETSUYA
Executed: 2010-08-02
SUGIURA, SHINOBU
Executed: 2010-08-02
UENO, MASAAKI
Executed: 2010-08-02
Assignee
HITACHI KOKUSAI ELECTRIC, INC.
14-1 SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property
(1)
Heating Device, Substrate Processing Apparatus, and Method of Manufacturing Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.