Patent Assignment
Reel/Frame 025105/0294
Change of Name
Recorded: 2010-10-05
Pages: 12
Assignor
FUJITSU MICROELECTRONICS LIMITED
Executed: 2010-04-01
Assignee
FUJITSU SEMICONDUCTOR LIMITED
2-10-23 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA 222-0033, JAPAN
Covered Properties
(3)
Carrier Substrate for Producing Semiconductor Device
Patent:
6,348,416 →
Application:
09/455,374 →
Resin for Semiconductor Wire
Method of Mounting an Electronic Part
Related Assignments
(10)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 18, 2006
From: HITACHI, LTD.; MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 018227/0458 →
Change of Name
Dec 24, 2008
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022052/0797 →
Assignment of Assignor's Interest
Feb 11, 2009
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 022240/0964 →
Assignment of Assignor's Interest
Feb 13, 2009
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 022248/0521 →
Change of Name
Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
Assignment of Assignor's Interest
Aug 26, 2014
From: SONY CORPORATION
To: SUGA, TADATOMO; SHARP KABUSHIKI KAISHA; KABUSHIKI KAISHA TOSHIBA; NEC CORPORATION
Reel/Frame 033610/0667 →
Change of Address
Oct 19, 2016
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 040419/0117 →
Change of Address
Oct 19, 2016
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 040419/0115 →
Change of Address
Oct 19, 2016
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 040419/0111 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →