Patent Assignment
Reel/Frame 025107/0288
Assignment of Assignor's Interest
Recorded: 2010-09-03
Pages: 3
Assignors
HWANG, TAE-JOO
Executed: 2010-08-29
CHUNG, TAE-GYCONG
Executed: 2010-08-27
AHN, EUN-CHUL
Executed: 2010-08-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Forming the Same