Assignment of Assignor's Interest

Recorded: 2010-10-08 Pages: 2

Assignors

KIKUCHI, TAKASHI

Executed: 2010-08-23

HASHIMOTO, TOMOAKI

Executed: 2010-08-25

HIRAI, TATSUYA

Executed: 2010-08-26

Assignee

RENESAS ELECTRONICS CORPORATION

1753, SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, JAPAN

Covered Property (1)

Method for Manufacturing a Package-on-Package Type Semiconductor Device

Patent: 8,314,493 →

Application: 12/900,407 →

Publication: US 2011/0089563

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.