Patent Assignment
Reel/Frame 025149/0572
Assignment of Assignor's Interest
Recorded: 2010-10-18
Pages: 12
Assignors
KANG, DAE-HYUK
Executed: 2010-09-30
YOON, BO-UN
Executed: 2010-09-30
LEE, KUN-TACK
Executed: 2010-09-30
SHIM, WOO-GWAN
Executed: 2010-09-30
CHA, JI-HOON
Executed: 2010-09-30
PARK, IM-SOO
Executed: 2010-09-30
LEE, HYO-SAN
Executed: 2010-09-30
KIM, YOUNG-HOO
Executed: 2010-09-30
OH, JUNG-MIN
Executed: 2010-09-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Integrated Circuit Capacitors Having Sidewall Supports and Capacitors Formed Thereby
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.