Patent Assignment
Reel/Frame 025153/0767
Assignment of Assignor's Interest
Recorded: 2010-10-18
Pages: 4
Assignors
LEE, KYU-HA
Executed: 2010-09-01
YOON, MIN-SEUNG
Executed: 2010-09-01
LEE, UI-HYOUNG
Executed: 2010-09-01
CHOI, JU-II
Executed: 2010-09-02
KIM, NAM-SEOG
Executed: 2010-09-02
MA, KEUM-HEE
Executed: 2010-09-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing the Semiconductor Device