Merger

Recorded: 2010-10-19 Pages: 3

Assignor

Executed: 2010-01-08

Assignee

UNIMICRON TECHNOLOGY CORP.

38 HSING PONG ROAD KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN

Covered Property (1)

Semiconductor Package Substrate Structure and Manufacturing Method Thereof

Patent: 7,847,400 →

Application: 12/114,517 →

Publication: US 2008/0272501

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.