Patent Assignment
Reel/Frame 025168/0480
Assignment of Assignor's Interest
Recorded: 2010-10-21
Pages: 3
Assignor
WANG, MENG-JEN
Executed: 2010-10-11
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26, CHIN 3RD. RD., 811, NANTZE EXPORT PROCESSING ZONE,, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Manufacturing Process Thereof