Patent Assignment
Reel/Frame 025185/0420
Assignment of Assignor's Interest
Recorded: 2010-10-22
Pages: 3
Assignors
LIM, DONG-CHAN
Executed: 2010-10-15
CHOI, GIL-HEYUN
Executed: 2010-10-15
PARK, BYUNG-LYUL
Executed: 2010-10-15
AHN, SANG-HOON
Executed: 2010-10-15
LEE, JONG-MYEONG
Executed: 2010-10-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Via Structures and Semiconductor Devices Having the via Structures