Patent Assignment
Reel/Frame 025190/0877
Assignment of Assignor's Interest
Recorded: 2010-10-26
Pages: 2
Assignee
BRIDGE SEMICONDUCTOR CORPORATION
3RD FLOOR, 157 LI-TE ROAD, PEITOU DISTRICT, TAIPEI, 112, TAIWAN
Covered Property
(1)
Semiconductor Chip Assembly with Bump/Base Heat Spreader and Cavity in Bump