IP Library › Assignment 025194/0156
Patent Assignment
Reel/Frame 025194/0156

Assignment of Assignor's Interest

Recorded: 2010-10-26 Pages: 6
Assignors
BARTLEY, GERALD K.
Executed: 2010-10-20
HOOVER, RUSSELL DEAN
Executed: 2010-10-26
JOHNSON, CHARLES LUTHER
Executed: 2010-10-21
VANDERWIEL, STEVEN PAUL
Executed: 2010-10-26
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Hybrid Bonding Techniques for Multi-Layer Semiconductor Stacks
Patent: 8,293,578 →
Application: 12/911,879 →
Publication: US 2012/0098140
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →