Patent Assignment
Reel/Frame 025211/0407
Assignment of Assignor's Interest
Recorded: 2010-10-28
Pages: 2
Assignor
SUWADA, MAKOTO
Executed: 2010-08-09
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8588, JAPAN
Covered Property
(1)
Method of Manufacturing a Wiring Substrate