Patent Assignment
Reel/Frame 025224/0596
Assignment of Assignor's Interest
Recorded: 2010-11-01
Pages: 4
Assignors
LEE, HEOK-JAE
Executed: 2010-10-28
KIM, SANG-HO
Executed: 2010-10-28
PARK, HYU-RIM
Executed: 2010-10-28
BAE, DO-IN
Executed: 2010-10-28
SEO, KEE-WEONE
Executed: 2010-10-28
WOO, CHANG-WOO
Executed: 2010-10-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 442-742, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Aligning Apparatus and Related Method