Patent Assignment
Reel/Frame 025224/0604
Assignment of Assignor's Interest
Recorded: 2010-10-29
Pages: 4
Assignors
TSENG, TZYY-JANG
Executed: 2010-10-07
WANG, CHIN-SHENG
Executed: 2010-10-07
CHUANG, CHIH-HONG
Executed: 2010-10-07
Assignee
SUBTRON TECHNOLOGY CO. LTD.
NO. 8, KUANG-FU N. RD., SCIENCE-BASED, INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Fabricating Method of Semiconductor Package Structure