IP Library › Assignment 025236/0846
Patent Assignment
Reel/Frame 025236/0846

Assignment of Assignor's Interest

Recorded: 2010-11-02 Pages: 3
Assignor
SHAH, JITESH
Executed: 2010-10-20
Assignee
INTEGRATED DEVICE TECHNOLOGY, INC.
6024 SILVER CREEK VALLEY ROAD, SAN JOSE, CALIFORNIA, 95138
Covered Property (1)
Flip Chip Bump Array with Superior Signal Performance
Patent: 9,332,629 →
Application: 12/938,196 →
Publication: US 2012/0104596
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →
Release of Security Interest Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION
Reel/Frame 048746/0001 →