Patent Assignment
Reel/Frame 025349/0472
Assignment of Assignor's Interest
Recorded: 2010-11-11
Pages: 2
Assignor
FUJII, NOBUTOSHI
Executed: 2010-09-27
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Method of Manufacturing Bonded Substrate, Bonded Substrate, Method of Manufacturing Solid-State Imaging Apparatus, Solid-State Imaging Apparatus, and Camera