Assignment of Assignor's Interest

Recorded: 2010-11-11 Pages: 4

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Assignors

HOHLFELD, OLAF

Executed: 2010-08-26

GOERLICH, JENS

Executed: 2010-08-05

BAYERER, REINHOLD

Executed: 2010-08-05

Assignee

INFINEON TECHNOLOGIES AG

ST.-MARTIN-STR. 53, MUENCHEN, 81669, GERMANY

Covered Property (1)

Method for Fabricating a Circuit Substrate Assembly and a Power Electronics Module Comprising an Anchoring Structure for Producing a Changing Temperature-Stable Solder Bond

Patent: 8,298,867 →

Application: 12/850,374 →

Publication: US 2011/0053319

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.

Corrective Assignment to Correct the Assignee Address Previously Recorded on Reel 025350 Frame 0921. Assignor(S) Hereby Confirms the Assignee Address Be Changed to Am Campeon 1-12, 85579 Neubiberg, Germany. Mar 13, 2011

From: HOHLFELD, OLAF; GOERLICH, JENS; BAYERER, REINHOLD

To: INFINEON TECHNOLOGIES AG

Reel/Frame 025942/0396 →