Patent Assignment
Reel/Frame 025352/0274
Assignment of Assignor's Interest
Recorded: 2010-11-12
Pages: 3
Assignor
HUNT, JOHN RICHARD
Executed: 2010-11-08
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOSIUNG R.O.C., TAIWAN
Covered Property
(1)
Wafer Level Semiconductor Package and Manufacturing Methods Thereof