Patent Assignment
Reel/Frame 025382/0047
Assignment of Assignor's Interest
Recorded: 2010-12-03
Pages: 2
Assignors
SASAKI, YOSHITAKA
Executed: 2010-11-17
ITO, HIROYUKI
Executed: 2010-11-17
IKEJIMA, HIROSHI
Executed: 2010-11-22
IIJIMA, ATSUSHI
Executed: 2010-11-22
Assignees
HEADWAY TECHNOLOGIES, INC.
678 S. HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035
SAE MAGNETICS (H.K.) LTD.
SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T., HONG KONG, CHINA
Covered Property
(1)
Layered Chip Package and Method of Manufacturing Same