Patent Assignment
Reel/Frame 025383/0370
Assignment of Assignor's Interest
Recorded: 2010-11-17
Pages: 3
Assignors
TU, HSIU-WEN
Executed: 2010-06-11
CHEN, HAN-HSING
Executed: 2010-06-11
HSIN, CHUNG-HSIEN
Executed: 2010-06-11
CHEN, MING-HUI
Executed: 2010-06-11
Assignee
KINGPAK TECHNOLOGY INC.
NO. 84, TAI-HO RD., CHU-PEI, HSIN-CHU HSIEN, 30267, TAIWAN
Covered Property
(1)
Manufacturing Method and Structure for Wafer Level Image Sensor Module with Fixed Focal Length
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.