Patent Assignment
Reel/Frame 025392/0193
Assignment of Assignor's Interest
Recorded: 2010-11-22
Pages: 3
Assignor
SADAKA, MARIAM
Executed: 2010-11-17
Assignee
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
CHEMIN DES FRANQUES, PARC TECHNOLOGIQUE DES FONTAINES, BERNIN, 38190, FRANCE
Covered Property
(1)
Methods of Forming Through Wafer Interconnects in Semiconductor Structures Using Sacrificial Material, and Semiconductor Structures Formed by Such Methods
Application:
12/879,637 →
Publication:
US 2012/0061794
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.