Patent Assignment
Reel/Frame 025396/0395
Assignment of Assignor's Interest
Recorded: 2010-12-06
Pages: 5
Assignors
LEE, GO EUN
Executed: 2010-11-24
CHO, TAEJE
Executed: 2010-11-24
KANG, UN-BYOUNG
Executed: 2010-11-24
RYU, SEONGMIN
Executed: 2010-11-24
KIM, JUNG-HWAN
Executed: 2010-11-24
MIN, TAE HONG
Executed: 2010-11-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Apparatus Having Through Vias Configured to Isolate Power Supplied to a Memory Chip from Data Signals Supplied to the Memory Chip