IP Library Assignment 025418/0188
Patent Assignment
Reel/Frame 025418/0188

Assignment of Assignor's Interest

Recorded: 2010-11-24 Pages: 3
Assignors
ENGLE, JASON C.
Executed: 2010-11-01
QUEZADA, DAVID
Executed: 2010-11-01
Assignee
LEGACY ELECTRONICS, INC.
211 AVENIDA FABRICANTE, SAN CLEMENTE, CALIFORNIA, 92672
Covered Property (1)
A Method for Fabricating a Circuit Board with a Three Dimensional Surface Mounted Array of Semiconductor Chips
Patent: 7,103,970 →
Application: 10/098,269 →
Publication: US 2002/0162215
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 7, 2005
From: KLEDZIK, KENNETH J.
To: LEGACY ELECTRONICS, INC.
Reel/Frame 016348/0780 →
Assignment of Assignor's Interest Oct 31, 2012
From: LEGACY ELECTRONICS, INC.
To: LEGACY ELECTRONICS, INC.
Reel/Frame 029215/0894 →
Security Interest Jul 29, 2014
From: LEGACY ELECTRONICS, INC.
To: GIBRALTAR BUSINESS CAPITAL, LLC
Reel/Frame 033430/0982 →