Patent Assignment
Reel/Frame 025425/0889
Assignment of Assignor's Interest
Recorded: 2010-11-29
Pages: 3
Assignors
UCHIDA, HIROSHI
Executed: 2010-11-09
UMEZAWA, TOMOKAZU
Executed: 2010-11-09
FUKUSHIMA, MASATO
Executed: 2010-11-09
TAKEYAMA, SHUNSUKE
Executed: 2010-11-09
SAKURAGI, TAKANORI
Executed: 2010-11-09
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Laminated Body for Manufacturing Resin Mold, Laminated Body, Resin Mold and Method for Manufacturing Magnetic Recording Medium
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
Assignment of Assignor's Interest
Oct 15, 2024
From: RESONAC CORPORATION
To: RESONAC HARD DISK CORPORATION
Reel/Frame 069167/0673 →