Patent Assignment
Reel/Frame 025435/0974
Assignment of Assignor's Interest
Recorded: 2010-12-02
Pages: 2
Assignors
ICHIRYU, MIWA
Executed: 2010-07-23
UEHARA, HIROYUKI
Executed: 2010-07-20
NISHIMURA, HIDETOSHI
Executed: 2010-07-12
Assignee
PANASONIC CORPORATION
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Semiconductor Device Including a First Wiring Having a Bending Portion and a via Including the Bending Portion
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.