Assignment of Assignor's Interest

Recorded: 2010-12-06 Pages: 2

Assignor

NISHIO, YOSHIFUMI

Executed: 2010-11-29

Assignee

OKI SEMICONDUCTOR CO., LTD.

550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN

Covered Property (1)

Manufacturing Method of Semiconductor Device, Semiconductor Device, and Method of Printing on Semiconductor Wafer

Patent: 8,361,877 →

Application: 12/960,733 →

Publication: US 2011/0163422

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.