Patent Assignment
Reel/Frame 025458/0758
Assignment of Assignor's Interest
Recorded: 2010-12-07
Pages: 3
Assignors
HUANG, PO-YAO
Executed: 2010-11-30
JIN, CHIA-YU
Executed: 2010-11-30
CHANG, YEONG-JAR
Executed: 2010-11-30
Assignee
FARADAY TECHNOLOGY CORP.
NO. 5, LI-HSIN RD. III, SCIENCE-BASED INDUSTRIAL PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Manufacturing Method Thereof