Patent Assignment
Reel/Frame 025467/0621
Assignment of Assignor's Interest
Recorded: 2010-12-08
Pages: 4
Assignors
TAIN, RA-MIN
Executed: 2010-11-10
LAU, JOHN H.
Executed: 2010-11-10
HSIEH, MING-CHE
Executed: 2010-11-10
LI, WEI
Executed: 2010-11-10
DAI, MING-JI
Executed: 2010-11-10
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG,, HSINCHU, 31040, TAIWAN
Covered Property
(1)
Measuring Apparatus That Includes a Chip Having a Through Silicon via, a Heater, and a Stress Sensor