IP Library › Assignment 025477/0539
Patent Assignment
Reel/Frame 025477/0539

Assignment of Assignor's Interest

Recorded: 2010-12-13 Pages: 3
Assignors
YU, CHEN-HUA
Executed: 2010-12-07
YU, CHUN HUI
Executed: 2010-12-07
LIN, JING-CHENG
Executed: 2010-12-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property (1)
Molded Chip Interposer Structure and Methods
Patent: 8,338,945 →
Application: 12/953,130 →
Publication: US 2012/0098123
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2024
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC
Reel/Frame 068326/0474 →