Patent Assignment
Reel/Frame 025483/0568
Assignment of Assignor's Interest
Recorded: 2010-12-09
Pages: 5
Assignors
SEO, KI HO
Executed: 2010-09-20
KIM, TAE HOON
Executed: 2010-09-20
SHIN, SANG HYUN
Executed: 2010-09-20
HEO, CHEOL HO
Executed: 2010-09-20
LEE, YOUNG KI
Executed: 2010-09-21
PARK, JI HYUN
Executed: 2010-09-21
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON,, GYUNGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Radiant Heat Substrate and Method for Manufacturing the Radiant Heat Substrate, and Luminous Element Package with the Radiant Heat Substrate