IP Library Assignment 025508/0958
Patent Assignment
Reel/Frame 025508/0958

Assignment of Assignor's Interest

Recorded: 2010-12-16 Pages: 3
Assignors
ONOZEKI, HITOSHI
Executed: 2010-10-28
TANABE, TAKAHIRO
Executed: 2010-10-28
SAITOU, KIYOSHI
Executed: 2010-10-28
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 1630449, JAPAN
Covered Property (1)
Two-Layered Laminate Having Metal Foil Cladded on Its One Surface, Method for Production of the Laminate, Single-Sided Printed Wiring Board, and Method for Production of the Wiring Board
Application: 12/935,668 →
Publication: US 2011/0108310
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address May 1, 2018
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD
Reel/Frame 046047/0563 →
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →