Patent Assignment
Reel/Frame 025511/0695
Assignment of Assignor's Interest
Recorded: 2010-12-16
Pages: 3
Assignor
YAMADA, TOMOKO
Executed: 2010-12-01
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Multilayer Wiring Substrate and Method of Manufacturing the Same