Patent Assignment
Reel/Frame 025512/0746
Assignment of Assignor's Interest
Recorded: 2010-12-16
Pages: 4
Assignors
WONG, SHAW FONG
Executed: 2010-12-09
LOH, WEI KEAT
Executed: 2010-12-09
ONG, KANG EU
Executed: 2010-12-09
WONG, AU SEONG
Executed: 2010-12-09
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Lower IC Package Structure for Coupling with an Upper IC Package to Form a Package-On-Package (PoP) Assembly and PoP Assembly Including Such a Lower IC Package Structure
Application:
12/970,114 →
Publication:
US 2012/0159118
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.