Patent Assignment
Reel/Frame 025520/0340
Assignment of Assignor's Interest
Recorded: 2010-12-17
Pages: 11
Assignors
LEE, CHUN-CHE
Executed: 2010-12-17
SU, YUAN-CHANG
Executed: 2010-12-17
LEE, MING CHIANG
Executed: 2010-12-17
HUANG, SHIH-FU
Executed: 2010-12-17
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOSIUNG (R.O.C.), TAIWAN
Covered Property
(1)
Embedded Component Device and Manufacturing Methods Thereof